| After-sales Service: | None |
|---|---|
| Warranty: | None |
| Grade: | Grade A |
| Thickness: | 1mm,2mm,3mm |
| Appearance: | Thin Mat |
| Color: | White |
| Samples: |
|---|
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier Super Thermal Insulation Ultra-Thin Material Flame Retardant High Temperature Resistant Porous Nano Vacuum Silicon Mat
With a thermal conductivity as low as 0.016W/m-K, our Nano Vacuum Silicon Mat provides superior heat insulation like never before. It forms a protective layer on non-heat generating devices, while also enhancing the heat dissipation performance of large heat generating devices. Say goodbye to overheating issues and hello to a cooler, more reliable product!
At just 0.3mm thin, our Ultra-Thin Flame Retardant High Temperature Resistant Porous Nano Vacuum Silicon Mat is incredibly slim and lightweight. It can be easily controlled in the form of rolls or sheets, allowing for seamless integration into various electronic devices. Plus, it can be customized to meet your specific requirements through die-cutting.
Imagine the possibilities with our Super Thermal Insulation Ultra-Thin Material! It's perfect for chip insulation in smartphones, tablets, laptops, batteries, game consoles, and more. Don't let heat hold you back - let our Nano Vacuum Silicon Mat revolutionize your devices and elevate your experience.
lt is made of polyester with low thermal conductivity as skeleton and silica Nano vacuum silicon as filler, and the Nano vacuum silicon heat insulation film is prepared by special process compound. Porous structure, uniform surface, low thermal
conductivity, as low as 0.016W/m-K, are used in smart devices. On the one hand, it can form a protective layer on the non-heat generating device or less heat generating device, on the other hand, a layer of heat insulation film is attached on the heat dissipation film of the large heat generating device, blocking the vertical low thermal conductivity channel without affecting the horizontal high thermal conductivity,making the back cover temperature lower than the human body sensory temperature, while not affecting the heat dissipation performance of the smart device, ensuring the stability of the product work and
improving the reliability of the product.
Features:
1.Thermal insulation film has ultra-low thermal conductivity, as low as 0.012W/(m-K)
2.Thermal insulation film has ultra-thin characteristic, down to 0.3mm
3.Heat insulation film can be controlled in the form of rolls and sheets, etc.
4.Heat insulation film can be die-cut directly. Customized die-cutting according to customers'
requirements.
Application :
Applications include chip insulation for smartphones, tablets, laptops, batteries, game consoles and
other electronic devices.
Technical data:
Suppliers with verified business licenses
Audited Supplier 
){kind=link}
){kind=link}